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Future Bus-DIP Type

MATERIAL

Insulator: Thermal Plastic, UL94V-0

Contacts: Copper Alloy

Shell: Brass (Nickel plated)

CONTACT PLATING

Underplate: 50μ” ~ 100μ” Nickel

Contact Area: 1μ” ~30μ” Selective Gold

Solder Tails Area:

100μ” ~ 200μ” Tin/Lead (Brighten Tin) or

100μ” ~ 200μ” Tin/Lead Free (Brighten Tin / Mattn Tin)

ELECTRICAL

Current Rating: 1 Amps Max.

Contact Resistance: 20-50 mohms Max.

Insulation Resistance: 1000 Mohm min @ 500VDC.

Dielectric Withstanding Voltage: 1000 VAC/ minute

Operating Temperature: -55°C to +125°C